- Adhesives & Sealants[6]
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- Other Plastic Raw Materials[4]
- Catalyst[1]
- Other Organic Chemical[2]
- Other Printing Materials[2]
- Transfer Printing[3]
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- Printing Inks[1]
- Other Chemicals[2]
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- Chemical Auxiliary Agent[5]
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- Contact Person : Ms. Huang Berry
- Company Name : Shenzhen Hong Ye Jie Technology Co., Ltd.
- Tel : 86-755-89948013
- Fax : 86-755-89756930
- Address : Guangdong,Shenzhen,Liulian Shibi Industrial Zone, Pingdi Town, Longgang District,Shenzhen
- Country/Region : China
- Zip : 518117
Addition cure encapsulant and potting compound
Related Product Searches:Addition cure encapsulant and potting compound,High Quality,silicone sealants, sealant silicone,HY-9055, HY-9060, HY-9300,HY-9301
Addition cure encapsulant and potting compound
1. Typical use
--------- high-power electronic components require a higher temperature heat and power modules and circuit board potting protection.
--------- high requirements of Radiation and heat resistance of power modules and the circuit board potting protection.
---------LED, the LCD electron display monitor, the advertising lights, the electronic circuit seal, electrical and electronic components, LED junction boxes, wind motors, and other substrates which has requirements about waterproof, insulation and heat conduction
2. Technical parameter of Addition cure encapsulant and potting compound
Model | HY-9055 | HY-9060 | HY-9300 | HY-9301 | |||||
Appearance | A | B | A | B | A | B | A | B | |
Dark gray fluid | White
| Dark gray fluid | White
| Transparent | clear | Dark | Transparent | ||
Before Curing | Viscosity(cps) | 2500±500 | 3000±500 | 600 ± 200 | 800 ± 200 | 2500 ± 200 | |||
Operating Perform | A and B (mixing ratio) |
1 to 1 | 1 to 1 | 1 to 1 |
1:1 | ||||
Mixed viscosity (cps) | 2000~3000 | 2500-3500 | 600-1000 | 2000-3000 | |||||
Operating time (min) | 120 | 120 | 180 | 300 | |||||
Curing time (min,25°C) | 480 | 480 | 480 | 480 | |||||
Curing time(min,80°C) | 20 | 20 | 20 | 30 | |||||
After Curing | (shore A) | 55±5 | 60±5 | 0 | 0 | ||||
Thermal conductivity [W(m·K)] | ≥0.8 | ≥0.8 | ≥0.2 | ≥0.3 | |||||
Absolute degree(kV/m) | ≥25 | ≥25 | ≥25 | ≥25 | |||||
Permittivity(1.2MHz) | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | |||||
Volume Resistance(Ω·cm) | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | |||||
Linear expansion coefficient [m/(m·K)] | ≤2.2×10-4 | ≤2.2×10-4 | ≤2.2×10-4 | ≤2.2×10-4 | |||||
Flane Resistance | 94-V1 | 94-V0 | 94-V1 | 94-V1 | |||||
Typical appliction
| Connecting box, power source and control module, automobile headlight and each kind of power source control module caking and protection | Fill and seals the module and the circuit board which has high requirements about radiation and heat resistant
| Suitable for electronic fitting insulation, the waterproofing and fixed
| General-purpose, LED, LCD electronic display, advertising lights, electronic circuits sealed | |||||
Addition cure encapsulant and potting compound
